TSV interconnects are critical to the development of 3D-ICs since they enable through-chip communication between the vertically stacked device layers. Currently, most TSVs employ a solid copper via ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

New Innovator3D IC suite enables faster design completion with capacity, performance, compliance and data integrity Calibre 3DStress delivers early analysis/simulation of chip/package interactions at ...

Samsung Electonics has announced that its silicon-proven 3D IC packaging technology, dubbed eXtended-Cube (X-Cube), is now available to customers. It claims to enable "industry-first 3D SRAM-logic ...

Mobile hand-held consumer electronic products have a rapid growing market today, witnessed by the popularity of Apple products. Most people make their first contact to internet, not by a PC, rather by ...

Amid the COVID-19 crisis, the global 3D IC and 2.5D IC Packaging Market estimated at USD 86.8 Billion in the year 2020, is projected to reach a revised size of USD 730 Billion by 2027, growing at a ...

Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, ...