1、电子设备热设计的需求与日俱增，随着电子产品热流密度的增加，温度控制不当成为现代电子产品失效的主要原因。 2、产品热设计在整机中所占据的成本比重迅速增加，热设计逐渐成长为产品核心竞争力因素之一。 3、产品迭代升级加快，性能、成本竞争 ...

Ansys Inc has announced the latest release of Ansys Icepak software, which provides fluid dynamics technology for electronics thermal management. The 12.0 release introduces new features for ...

Ansys Inc has announced the latest release of Ansys Icepak software, which applies fluid-dynamics technology to electronics thermal management. The 12.0 release introduces new features for PCB ...