The American Bureau of Shipping (ABS) and Siemens Energy have entered a joint development project (JDP) focused on improving ...

Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Electromagnetic-thermal co-simulation methods integrate the numerical assessment of electromagnetic fields with thermal analysis to predict the coupled behaviour of systems in which heat generation ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Dublin, July 07, 2025 (GLOBE NEWSWIRE) -- The "Global Market for Thermal Management Systems and Materials for Advanced Semiconductor Packaging 2026-2036" report has been added to ...

The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...