The design stage of a product’s life cycle is arguably one of the most crucial decision making periods, as 70 to 80 percent of the overall manufacturing cost can be projected at this stage. Engineers ...

In the competitive world of electronics manufacturing, a profound truth often goes unrecognized until expensive lessons force ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

The Fred Young Submillimeter Telescope (FYST) is a 6-meter-diameter state-of-the-art telescope designed to operate at submillimeter to millimeter wavelengths for wide field observations and large-area ...

Some joint-design considerations are universal; others vary with the assembly methods used. Each joining technique has particular design requirements, while certain joint requirements may suggest a ...

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...