The 2D devices fabricated using CDimension’s ultra-thin films have demonstrated up to a 1,000X improvement in ...
Low power design has become a cornerstone of modern integrated circuit development, driven by energy efficiency demands and the challenges of scaling in nanometre technologies. Innovations in ...
Finnish company Semiqon has developed a transistor that operates with virtually zero heat dissipation. They have made silicon-based quantum processors to make future quantum computers more affordable, ...
The International Electron Devices Meeting (IEDM) held Dec. 2-6, 2017, in San Francisco offered imec and Leti an opportunity to disclose several innovations. imec announced three new developments: ...
For more than three decades bulk-silicon MOSFET has been the transistor workhorse of CMOS technology. We have become terribly addicted to the density and performance gain from shrinking it. More speed ...
Amorphous oxide semiconductors like IGZO (indium gallium zinc oxide) offer acceptable carrier mobility with very low leakage.
Intel's upcoming RibbonFET technology is set to debut in the company's 20A node next year, but already the chip maker is showcasing the next step: 3D stacked CMOS (complementary metal oxide ...
June 12, 2003 - Intel Corporation revealed new details of its advanced “tri-gate” transistor design this week at the 2003 Symposia of VLSI Technology and Circuits in Kyoto, Japan and said that the tri ...
make use of 300-mm wafers. "Our ongoing research allows us to stay on the forefront of transistor design, which translates into increasingly powerful processors. Transistor technology is the 'engine' ...
Not so long ago, a computer filled a whole room and radio receivers were as big as washing machines. In recent decades, electronic devices have shrunk considerably in size and this trend is expected ...
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