Sharp has combined three LED lighting components – a chip-on-board (CoB) emitter, holder and thermal interface – in one solderless assembly. The result is a more straight-forward way to build a high ...
伴随着Mini&Micro LED产品创新与市场份额扩大，COB和MIP之间的主流技术之争已经“打得火热”。封装技术的选择对Mini&Micro LED的性能与成本而言影响是至关重要的。 传统的SMD技术路线是将RGB（红、绿、蓝）三色各一颗的发光芯片封装成灯珠，再通过SMT贴片锡膏焊接 ...
As North America's leading professional AV trade event, InfoComm, organized by AVIXA, gathers integrators, engineers, and system builders from around the world. At Booth #1221, DECO and its core ...
近日，中麒光电全国巡展接连走进济南、上海，与各大LED产业伙伴共同探讨LED直显微间距的发展趋势。 作为LED显示微间距化发展下重要的产品技术趋势，近年来采用COB封装技术的Mini&Micro LED产品创新与市场份额正在迅速扩大。 2023年以来，COB开始对SMD市场进行 ...
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