Copper electrodeposition is a vital process in the fabrication of microelectronic interconnects, battery components and decorative coatings. By utilising carefully formulated electrolytes and ...

San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...

An international research group has achieved a 22.1% power conversion efficiency in a bifacial heterojunction crystalline solar cell fabricated through copper (Cu) plating metallization. “We developed ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...