As semiconductor components continue to shrink, the challenges associated with design-for-manufacturing (DFM) and design-technology co-optimization (DTCO) increase. The complexity of the IC design and ...

Siemens today announced Inventec Corporation, a global leader in high-tech electronics and server manufacturing, has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the ...

Digital manufacturing innovator Fictiv has further enhanced its injection molding services by launching automated design for manufacturability (DFM) capabilities that give customers free, instant ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...