Top-tier investor syndicate co-led by Khosla Ventures and SV Latam Capital (SVLC) with participation from Sandhill Angels and Y Combinator The financing will be used to expand the team and prepare its ...

Air bubbles pose a significant risk in sensor encapsulation, potentially compromising protection and reliability. Master Bond addressed this by implementing rigorous degassing protocols prior to ...

LEON and Harro Höfliger to build and commercialize LEON’s NANOus, a novel aseptic manufacturing device to facilitate commercial production of LNP-encapsulated genetic materials and other APIs By ...

OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it developed a semiconductor encapsulation material for power devices that boasts the industry's top-class *1 heat-resistance ...