The use of Graphics Processing Units (GPUs) to accelerate the Finite Element Method (FEM) has revolutionised computational simulations in engineering and scientific research. Recent advancements focus ...
Belgian research lab Imec has revealed 3D stacked memory-on-GPU AI processor thermal data at IEDM (IEEE International Electron Devices Meeting) this week. The data comes from a thermal STCO ...
3D HBM-on-GPU design reaches record compute density for demanding AI workloads Peak GPU temperatures exceeded 140°C without thermal mitigation strategies Halving the GPU clock rate reduced ...
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