Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Sigrity Inc this week introduced OrbitIO Planner, a tool for dynamic I/O planning across IC, package, and PCB (printed-circuit-board) design. To date, the company has offered tools for IC, package and ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

This file type includes high resolution graphics and schematics when applicable. In the development of SoC-based (system-on-chip) circuit boards, the SoC’s additional capabilities will provide ...