At this week's HotChips 34 conference, Intel CEO Pat Gelsinger laid out his company's vision for the future, and a cornerstone of that vision is advanced packaging combining multiple chiplets. That's ...

Intel Wednesday demonstrated its revolutionary three-dimensional (3-D) Tri-Gate transistor technology in a 22-nm microprocessor, code-named Ivy Bridge, that is already being used in prototype laptops, ...

Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology, among ...