TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

This family of lead-frame packages has been extended to include dual-sided units. Said to combine the performance of array packages with the lower cost of lead frames, the dual, fine-pitch, no-lead ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

Report Ocean published the latest research report on the Semiconductor Lead Frame Market. In order to comprehend a market holistically, a variety of factors must be evaluated, including demographics, ...

Report Ocean has released a market research report on the Semiconductor Lead Frame Market, covering 150+ countries and analyzing over 1,00000 published and forthcoming reports per year. The report, ...

Australian technology firm Lednium has developed a domed lead-frame package to improve light distribution in LED lighting. “It is a natural progression when creating a source of Illumination from what ...

PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) said today (April 28, 2003) it has developed a style of package it calls flip-chiip on standard leaded (FCOSL) packages. These ...