A new lithium metal battery without an anode achieves record-breaking energy density, potentially revolutionizing the ...

Copper interconnect was introduced to the mainstream at 130nm because of its significant advantages compared to aluminum, such as reduction in resistivity and power consumption and resistance to ...

In VLSI layout design, density issues are critical factors influencing the performance, yield, and reliability of integrated circuits. This whitepaper delves into the several types of density issues, ...

For millennia people have purchased and relied on metals for decorative and industrial uses, figuring out their values based on their practical applications and visual luster. Today, precious and ...

In the past decade, chemical-mechanical polishing (CMP) has emerged as the predominant planarization technique for shallow trench isolation (STI) and back end of the line (BEOL) metallization. To ...