In this interview, Alex Shikany, EVP for A3, breaks down new industry data on packaging robotics, explaining how workforce ...

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics chips, strengthening the country's vehicle-grade ...

Samsung Electronics is weighing advanced semiconductor packaging and robotics as future growth drivers, with plans to discuss development strategies at its upcoming global strategic meeting, according ...

Inverting the Fanuc LR Mate 200iD six-axis robot (rear, center) significantly reduced the machine’s footprint. A creative "vanishing tray" design uses pneumatic cylinders to drop empty trays through ...