An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...

Use left and right arrow keys to seek audio. TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at ...

Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level package) process, ...

The Firefly G3 system delivers unique inspection and metrology process control technologies aimed at buried defects and voids supporting next generations of glass and copper clad laminate (CCL) The ...

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WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep ® X500 panel-level packaging lithography system with ...

Heterogeneous integration refers to the assembly of disparate semiconductor components—such as logic, memory and analogue dies—into a unified package, leveraging advanced interconnect and ...