IHS Markit said it expects the United States, Germany, and the Netherlands to be the top three markets for cumulative shipments of module-level power electronics in the 2022-26 period. Cumulative ...

New high-voltage silicon carbide power modules aim to improve efficiency, reduce losses, and simplify next-generation power ...

South Korea-based semiconductor company SEMIPOWER is developing next-generation power semiconductor module solutions centered on wide bandgap (WBG) materials including silicon carbide (SiC) and ...

Damage to a relay contact after cyclic current loading. A better understanding of inverter reliability will help boost performance and reduce costs. Image: Fraunhofer IMWS. Inverters are critical to ...

The company is introducing a new 1300 V silicon carbide (SiC) module within the HybridPACK Drive family capable of continuous operation at temperatures up to 205°C - existing designs typically allow ...

Tigo Energy announced a new line of module-level power electronics (MLPE), the Tigo TS4-X line. The MLPE product line is designed to support newer high-powered solar modules with power ratings up to ...

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to ...

Microchip Technology has launched a new range of 3.3 kV silicon carbide (SiC) power modules to support SST designs.

Small solution sizes and high integration levels are required for extremely space-constrained systems, such as optical modules and solid-state drives (SSDs). While integrated power modules tend to be ...

As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily increases the amount of heat to be ...

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