Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to ...

South Korea-based semiconductor company SEMIPOWER is developing next-generation power semiconductor module solutions centered on wide bandgap (WBG) materials including silicon carbide (SiC) and ...

New power modules have an optimized high-efficiency, compact, and durable design that is ideal for BLDC motor drives The Mega IPM7 series is AOS’ new generation of intelligent power modules engineered ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified transportation—researchers at the National Renewable Energy Laboratory have unveiled a ...