PITTSBURGH, Oct. 24, 2019 /PRNewswire/ -- ANSYS (NASDAQ: ANSS), the global leader and innovator of engineering simulation software, announced today that it has entered into a definitive agreement to ...

New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes ...

San Jose, Calif. — The addition of nonvolatile memory to a system-level IC is never an easy proposition. Often, design teams take the easy way out and simply put flash in an external chip. If ...

Desktop Metal estimates it will incur one-time termination benefits and associated costs related to the strategic integration and cost optimization initiative of approximately $14.0 million, of which ...