NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

Aptiv PLC (NYSE: APTV), a global industrial technology company and Winchester Interconnect, an Aptiv company and leading ...

With the exception of the iPhone, Apple's products largely lack technology to provide ubiquitous access to the outside world while on the go. However, a new proposal from the company would attempt to ...

No audio available for this content. TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new ...

GREENSBORO, N.C.--(BUSINESS WIRE)--Guerrilla RF, Inc. (OTCQX: GUER) today announced that its high-efficiency GRF5509 4-watt power amplifier was selected by Impinj (NASDAQ: PI) for use in their ...

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Next-generation RF to millimeter-wave silicon MMIC and module product development software Cadence is excited to announce the launch of its latest RF design and analysis platform, Virtuoso Studio RF.

One of the most complex parts of enabling 5G is mmWave frequencies and the antennas and front-ends that control them. MmWave technologies have never been used for mobile cellular communications before ...

US-based Master Electronics has added RF modules to its offering with the signing of French RF module specialist, Insight SIP. The distributor is based in Phoenix, Arizona but ships worldwide as ...

Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...