SHENZHEN, GUANGDONG, CHINA, June 11, 2026 /EINPresswire.com/ -- Reliability in printed circuit board assembly often ...

The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

In our previous issues in this series on making circuit boards, we covered placing solder paste and placing components. Now it’s time to bake our cake! There are a variety of methods for reflowing a ...

Japanese storefront Shigezone has recently listed a USB PD (Power Delivery)-operated reflow oven. The top plate reaches a maximum temperature of 280 degrees Celsius at default settings or 350 degrees ...

Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

Ever since automated optical inspection (AOI) became a mainstay of a manufacturer's test strategy, planners have debated where to place it in the production process. Do you inspect the solder paste ...