Digital photoelasticity is a powerful optical technique that leverages the stress-induced birefringence in transparent materials to map the distribution of internal stresses. The method has evolved ...

Intergraph Releases CAESAR II 2011 R1 for advanced integration with Smart 3D & SmartPlant Review for data transfer from piping design to the engineering environment. Intergraph has released an ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...