Heatsink technology has rapidly improved over the last few years. The introduction of heatpipes, use of large radius fans and the sophisticated mounting mechanisms have all aided these developments.

Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

This whitepaper discusses the advantages of transient thermal test methods for IC package and thermal interface material (TIM) thermal characterization testing vs steady state methods. These methods ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ:MENT) today announced that JEDEC, the organization dedicated to open standards in the microelectronics industry, has approved a ...

Hyundai-Kia America Technical Center (HATCI) and Forward Engineering North America LLC recently worked together to design a new method of testing thermal runaway performance in composite materials for ...

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it much more difficult to identify and test for thermal issues in advanced ...

Over the years, standards organizations have undertaken numerous efforts to standardize the test methods that are used to characterize the thermal performance of semiconductor devices. Groups such as ...

Due to their light weight and optimal mechanical properties, modern composite materials, such as carbon fiber-reinforced polymers (CFRP), are increasingly used in automotive, wind energy and ...

As the transistor density and switching speed of integrated circuits (ICs) increase and the package size decreases, the emerging generation of high-power ICs requires thermal management during testing ...