DUBLIN--(BUSINESS WIRE)--The "Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028" report has been added to ResearchAndMarkets.com's offering.

FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

The "Thin Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering.The thin wafer market is experiencing robust growth, poised to expand from $12.57 billion in 2025 to $19.45 ...

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a... STATS ChipPAC has ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...