GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

In the fast-paced world of semiconductor manufacturing, achieving higher yields and reducing costs are constant challenges. Ideally, yield should only be impacted by unavoidable defects when ...

Test-flow partitioning between wafer sort and final package test can have a dramatic impact on the cost of test. In some cases, the migration of package tests can be done over time, but the test ...

The emergence of 3-D ICs presents test challenges that extend from design-for-test tools from design-automation companies to device handlers from equipment firms including Advantest and Multitest. A ...

The new facility forms part of ICsense’s latest strategic investment programme and is intended to support growing demand for custom ASIC solutions across multiple industries. The global ASIC market is ...

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...