一、CMP：“小而美”的半导体关键工艺装备 （一）CMP 设备是半导体制造的关键工艺装备之一 CMP（Chemical Mechanical Polishing，化学机械抛光）是半导体制造过程中 实现晶圆全局均匀平坦化的关键工艺。晶圆制造过程主要包括7个相互独立的工艺流程：光刻、刻蚀 ...

Chemical mechanical polishing (CMP) is a process of global planarization that leverages the synergetic effect of chemical reactions and mechanical abrasion to facilitate wafer polishing. CMP has ...