Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...

Santa Cruz, Calif. — At first glance, the Pilot Design Environment from Synopsys Inc. may sound like a resurrected EDA framework from the late 1980s. But Synopsys claims to be taking a fresh approach ...

SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

Siemens collaborates with TSMC to advance AI-powered automation across the semiconductor design workflow, including AI automated Design Rule Check (DRC) fixing flows and Fuse EDA AI system integration ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its custom and analog/mixed-signal (AMS) IC design flow has achieved certification for Samsung ...

Cadence Design Systems and United Microelectronics Corporation (UMC) have jointly announced that the US-based EDA firm's analog/mixed-signal (AMS) IC design flow has achieved certification for the ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...

United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies. Some subscribers prefer ...