The new manufacturing method deals with the packaging substrate, the material to which chip dies are bonded. Intel and others have long used plastic (also known as organic) substrates, but the ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

(Bloomberg) -- A secretive American startup has emerged with aspirations to challenge two titans of the semiconductor industry: ASML Holding NV and Taiwan Semiconductor Manufacturing Co. The company, ...

Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...

The expansion of demand for artificial intelligence (AI) is energizing industries across the board. One of the hottest emerging markets in this ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...