TetraMem Inc. today announced that its academic and research collaborators have demonstrated RRAM (memristor) devices capable ...

A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static storage of AI model weights, with optimized read speed. Samples are due out later ...

Importantly, I noted that Micron has disclosed that each gigabyte of HBM3E requires roughly three times the silicon wafer ...

This project provides a simple and practical solution using an Interactive Voice Response System (IVRS) that works completely ...

An increasing percentage of the chip area is consumed by the same amount of SRAM for each node shrink. The problem is not limited to leading-edge AI, as it will eventually impact even small MCUs and ...

Samsung Electronics Co. is considering a shift toward multi-year contracts for memory chips, a much longer timeframe than is typical that may help stabilize supply and ease concerns about a shortage ...

Abstract: In this paper we analyze the Multi-Level Cell (MLC) capability in Phase-Change Memory 4kb arrays based on Ge-rich GeSbTe alloys featuring high temperature data retention. Two Ge-rich alloys ...

In the current AI landscape, we’ve become accustomed to the ‘ephemeral agent’—a brilliant but forgetful assistant that restarts its cognitive clock with every new chat session. While LLMs have become ...

Abstract: In-memory computing (IMC) for logic functions executes a target function via a series of logic operations supported by peripheral devices. Because these operations are performed on multiple ...

Quantum computers, systems that process information leveraging quantum mechanical effects, will require faster and energy-efficient memory components, which will allow them to perform well on complex ...