Gold wire bonding is a process used in microelectronics packaging to connect a semiconductor device to a metal lead frame or a substrate. In this process, a thin wire made of gold is used to create the electrical connections between the device and the lead frame or substrate. The gold wire bonding process involves several steps. First, the gold wire is fed through a capillary that is attached to a bonding tool. The tool is then moved to the desired location on the device or substrate, where it m